Professional PCB processing low pressure sealing products

Professional PCB processing low pressure sealing products
Low pressure injection molding process is a kind of using small injection pressure (1.5 ~ 40 bar) to injection mold and rapid curing encapsulation materials (5 ~ 50 seconds) encapsulation process method, in order to achieve insulation, heat resistance, impact resistance, anti-vibration, moisture-proof, waterproof, dustproof, resistance to chemical corrosion and so on. The technology originated in Europe's car industry, so far in Europe and the United States, Japan and South Korea, and other areas of the automobile industry and electronic electric field has been successfully applied for more than ten years, is still at the preliminary stage in our country. Its application field is very broad, including: printed circuit board (PCB), automotive electronics, automotive wiring harness, automotive connectors, sensors, micro switch, antenna, and so on